Multi-layer PCB Materials for Fifth-generation Communication
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As we enter the age of hyper-connected intelligence such as artificial intelligence, big data, IoT, self-driving cars, and remote medical care, 5G communication that transfers a lot of data at high speed emerges and an era beyond it is coming. 5G communication has great advantages in terms of speed, capacity and simultaneous access to multiple terminals in high frequency bands. However, the transmission distance of high-frequency radio signals is short, so many transmitting stations must be installed, and the PCB board material needs to be improved. In this presentation, we would like to present the development of the following materials. 1) low-dielectric low-loss glass and glass fiber required for manufacturing ultra low loss PCB substrates. 2) low dielectric polymer materials as an insulating layer 3) copper nanoparticles by nanotechnology and fine patterned copper layer using printing technique