Aramid Nanofiber-Reinforced TLCP Nanocomposite Films with Improved Dielectric and Mechanical Properties
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초록
내용
The advancement of hyper-connected intelligence and the widespread use of electronic communication devices have underscored the need for substrate materials with lower dielectric constants and dielectric losses than conventional printed circuit board (PCB) materials. Thermotropic liquid crystalline polyesters (TLCPs) have emerged as a promising option for such PCB substrates, boasting advantages like low dielectric constants, minimal moisture content, and thermal stability. However, the rapid crystallization rate and chain orientation inherent in TLCPs pose significant challenges in producing thin films. In this research, we address these challenges by fabricating high-performance TLCP-based nanocomposite films, incorporating aramid nanofibers as reinforcement. The combination of TLCPs and aramid nanofibers presents a novel design strategy for developing ultrathin films with low dielectric constants and superior thermostability, catering to applications in high-end PCB substrates.