Effects of solvents and surfactants on self-assembled monolayer formation of alkanethiol on Cu
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초록
내용
Corrosion of copper (Cu) is considered a significant reliability issue in microelectronic packaging, causing reduced bonding strength and delamination of packages. One of potential solutions is to form self-assembled monolayers (SAMs) using alkanethiols to protect Cu against oxidative environments. In this study, we prepared stable dispersions of alkanethiols in water by incorporating various non-ionic surfactants or alcohol additives. The change in hydrophobicity was assessed by measuring water contact angles on Cu plates. The oxidative stability was evaluated through optical microscopy after exposing the sample in a humidity chamber.