Enhancement of interfacial adhesion between epoxy composites and substrateusing eco-friendly coupling agent (ECA).
발표자
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초록
내용
Epoxy molding compound (EMC) is used to protect semiconductor devices, and bond semiconductor chips and substrate in semiconductor molding process. The enhancement of adhesion between EMC and lead frames affects the reliability of semiconductor package. We used eco-friendly coupling agent (ECA). The ECA has carboxyl group and amine group which can interact with the hydroxyl group on surface of Cu and Ni lead frame. To analyze surface chemical property, we calculated the surface energy of EMC adding ECA by contact angle using water and diiodomethane. We also measured heat resistance with Thermogravimetric Analyzers (TGA) of epoxy composite samples. We used Universal Testing Machine (UTM) to confirm the changes of adhesion strength between EMC with ECA and Cu or Ni substrate.