Carboxylate-based polymeric adhesion promoters for improved adhesion properties between epoxy molding compound and lead frame.
발표자
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초록
내용
Enhancing the bond between epoxy molding compound (EMC) and lead frame is vital in semiconductor packaging research. Adhesion promoters are commonly used for this purpose. In this study, we synthesized a carboxylate-based polymeric adhesion promoter (CPAP) to improve the adhesion between the EMC and the lead frame. CPAP was synthesized by applying itaconic acid (IA), acrylamide (AAM), and 2-carboxyethyl acrylate (CEA). The properties and interfacial adhesion mechanism of CPAP were studied by varying the content of CEA. The chemical structure of each sample was characterized using Fourier transform infrared spectroscopy. Energy dispersive spectrometry (EDS) mapping analysis was performed to find out the degree of dispersion of adhesion promoters in EMC. The interfacial adhesion of EMC containing CPAP on Cu and Ni substrates was measured by universal testing machine. As a result, the adhesion of the CPAP-applied EMC in which it was evenly distributed was improved compared to that of bare EMC.