Melt-Processable Thermosetting Polyimides Based on Phenylethynyl-Terminated Oligoimides
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Aromatic polyimides (PIs) have been successfully used as the matrix of composites in the manufacture of aviation and aerospace vehicles, owing to their excellent thermal stability, good mechanical properties, and dielectric properties. However, they are usually difficult to process because of the poor melt fluidity and the volatiles release. It has been found that the introduction of end-capped agents at the end of PIs chains could limit the molecular weight of PIs and increase their processability. Many of them can cure at high temperatures and yield crosslinked networks that can impart good heat-resistance to cured resins. Among them, phenylethynyl-terminated PIs exhibit good processability and thermal stability after curing. In this study, a series of oligoimides derived from a-BPDA and 6FDA with different diamines were designed and synthesized. The melt-processability, cure kinetics, and thermal properties of oligoimides with different backbone structures were compared.