Preparation of Self-Healing Capsules using Liquid Metal/Polyimide
발표자
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초록
내용
Liquid metal at room temperature can be applied to electrode materials of various electronic devices in virtue of their flowability and high conductivity. In this study, the purpose is to prepare a liquid metal capsule that can maintain the capsule shell even in a high-temperature soldering process using polyimide. Liquid metal flow out from the ruptured capsules and fill the damaged site upon cutting or pressing, leading to effective recovery of electrical pathways. After modification of the liquid gallium alloy particles, the liquid metal was encapsulated through chemical bonding between surface amino group and the end group of polyimide. Shell materials were identified by SEM and EDS, and liquid metal present in the core was well preserved even after the high temperature process by XRD.