Eco-Friendly Preparation and Characterization of Highly Thermally Conductive Polyimide/Boron Nitride Composite Films
발표자
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초록
내용
Polyimide/boron nitride (PI/BN) composites have attracted much attention as heat dissipation materials in electronic packaging due to their outstanding characteristics such as excellent thermal stability and electrical resistivity, low dielectric constant, and high chemical resistance. However, PI/BN composites were generally prepared by combining a BN suspension and a poly(amic acid) (PAA) precursor using toxic organic solvents such as dimethylacetamide (DMAc), dimethylformamide (DMF), or N-methyl-2-pyrrolidone (NMP). In this study, we provide the eco-friendly preparation method of highly thermally conductive PI/BN composite films using green solvents. Then, in-plane and out-of-plane thermal conductivities, mechanical properties, and heat dissipation ability of PI/BN composite films were investigated.