Development of core material technology for ultra-high resolution/highly flexible display backplane
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초록
내용
Metal oxide semiconductor materials and polyimide varnish are developed for high performance display backplane application. Non IGZO type metal oxide semiconductor deposited by ALD method can be applied to ultra high resolution display. High-temperature-resistant varnish PI with good transparency can be applicable to stretchable display backplane with patterning processes. The verification and evaluation platform for these materials using full display backplane processes are also developed.