A study on the synthesis of silsesquioxane oligomers capable of odor control and the thermal properties of epoxy molds using the same.
발표자
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초록
내용
The one-component epoxy adhesive undergoes a crosslinking reaction through heating to cause curing, and usually requires a temperature of 120 °C or higher. Thus, the general adhesive curing conditions may damage the temperature-sensitive electronics. Most of the mercaptan curing agents having -SH functional groups are used in liquid form, and in general, the curing reaction between epoxy and mercaptan is faster at low temperature than the reaction between epoxy and amine, so it is expected to show fast curing properties at low temperature. However, hardening agents containing thiol groups had problems in application due to the unique odor of sulfur. Therefore, in this study, a curing agent containing a thiol group was prepared using the one-pot method. The odor level of the thiol curing agent was analyzed by introducing the air sensory dilution method. In addition, the thermal properties of the epoxy-based mold including the hardener having a -SH functional group were analyzed.