Synthesis and Characterizaition of Polyimide Film Containing Amdie Group
발표자
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초록
내용
Polyimide (PI) is a polymer with thermal stability and and has excellent mechanical strength, chemical stability, resistance, etc. In this study, a series of polyimide films were prepared from anhydrides (4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA), disodiumoctaborate anhydrate (DSDA), 4,4'-oxydiphthalic anhydride (ODPA), 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA)) and two types of amide-containing diamine. The chemical structure of the diamine monomer was analyzed using Fourier transform nuclear magnetic resistance (FT-NMR) and Fourier transform infrared spectroscopy (FT-IR) and thermo-mechanical properties of polyimide films were examined using thermo-gravimetric analyzer (TGA), Differential scanning calorimetry (DSC) and universal tensile machine (UTM). The results confirmed that the thermal decomposition temperature was excellent heat resistance above 500℃ and the tensile strength above 80MPa.