Anisotropic Conductive Polymer Adhesive Based Nanoscale Dewetting for Assembly of Microscale Electronics
발표자
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초록
내용
The evolution of electronic devices has shown unprecedented progress. Electronic devices will become smaller and be densely integrated on limited areas. As electronic components become smaller at microscale, there are some limitations on practical methods such as size limitation, low throughput, poor mechanical stability and high pressure and heat for bonding. Here, we introduce a new electrical interconnection method driven by selective dewetting of polymer adhesive that is applicable to a deterministic microelectronics assembly. As the stability of thin polymer adhesive depend on the materials of substrate, and the thickness of adhesive, the wettability of polymer adhesive could be controlled by modulating the condition of the coated polymer adhesive. The minimum feature size for assembling microdevices is 30 × 60 μm2 for microscale inorganic LED. This interconnection system can suggest a new avenue on the field of biomedical and wearable electronic devices.