Development of Low Dielectric Adhesives using Click-Reaction for Advanced Electronic Devices
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초록
내용
With the rapid growth of 5G communication based high-speed transmission-reception systems, development of a low dielectric material is imperative to advanced electronic devices. Thus, it is essential to develop an adhesive having a low dielectric constant and maintaining high adhesion between a copper foil and a low dielectric polymer sheet simultaneously. Herein, a low dielectric adhesive is proposed through thiol-ene click reaction, applicable to electronic devices for 5G communication. We optimized the composition of the adhesive by controlling ratios of the compounds with alkene or thiol groups. The dielectric constant was 2.7 at 10 GHz, lower than that of existing commercially available adhesives. The peel strength was 1.0 N/mm by means of 90° peel test, showing high adhesion between the copper foil and the low dielectric sheet. The result shows this low dielectric adhesive can be applicable to 5G communication technology such as semiconductors, automobiles, mobile phones, etc.