Water-proof and insulating encapsultion for flexible electronics with improved longevity and robustness
발표자
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초록
내용
The growing demands for flexible electronics have driven an innovative growth in encapsulation technology. However, conventional encapsulation materials such as inorganic materials have faced several limitations including mismatch in flexibility, complex fabrication processes, and poor applicability to materials with complex geometries. Here, we developed an organic polymer based encapsulating material to overcome the limitations of the inorganic encapsulations. By using liquid-phase deposition, flexible substrate was coated with an adhesive polydopamine layer followed by fluorinated polymer layer which act as a protection layer vital to its encapsulation capabilities. Then, the substrate was swollen in fluorinated oil which exhibit water-repellant, antifouling, and insulating properties. To demonstrate long-term protection against moisture penetration, we confirmed the insulation properties through leakage current and EIS measurements.