Synthesis and Thin Film Properties of Novel Photocurable Polyimide Gate Insulator with the Epoxy-Containing Crosslinker
발표자
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초록
내용
Hydroxyl group substituted soluble polyimide (DOCDA-6FHAB) was prepared with a simple one step condensation polymerization from the reaction of 5-(2,5-dioxytetrahydrofuryl)3-methly-3-cylohexene-1-2-dicarboxylic anhydride (DOCDA) and 5,5'-(perfluoro propane-2,2-diyl)bis(2-aminophenol) (6FHAB). DOCDA-6FHAB polymer was mixed with trimethylolpropane triglycidyl ether (TTE) as photo-cross-linking agent. The process through photo-curing has the advantage of lowering the process temperature until 160 oC, when manufacturing a film. We have confirmed the photo-cross-linking process through FT-IR measurement before and after UV-visible exposure of polymer film. Crosslinked DOCDA-6FHAB film showed good surface roughness as root mean square (rms) value as about 0.319 nm in AFM measurement and the surface tension of crosslinked DOCDA-6FHAB was also found to 47.68 dyn/cm. Detailed film fabrication condition and further thin film properties will be presented.