Dual-cure adhesive with enhanced thermal resistance: Preparation of epoxy terminated polybutadiene
발표자
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초록
내용
We modified hydroxyl terminated polybutadiene (HTPB) to epoxidize its hydroxyl group at the ends. We applied the epoxidized (ETPB) to a thiol/acrylate adhesive system to investigate dual-cure characteristics. We suggested a synthetic mechanism for the ETPB and also photo/ thermal dual-cure mechanism. We confirmed the structure of the ETPB using fourier transform infrared and nuclear magnetic resonance spectroscopy. Furthermore, we evaluated thermal properties via thermogravimetric analysis and differential scanning calorimeter. We measured lap-shear strength according to molar ratio of ETPB and thiol/acrylate using a universal testing machine. We evaluated storage stability of dure-cure adhesives according to the stabilizer content and gel fraction.