Heat dissipation properties of PS/silica-coated CuNW nanocomposites prepared by latex technology
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초록
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Along with the development of electrode materials using polymer nanocomposites, materials that emit heat generated at the interface are also attracting great attention. In this study, the heat dissipation characteristics of polystyrene (PS)/copper nanowire (CuNW) nanocomposites were investigated. After synthesizing CuNWs having high aspect ratio and excellent thermal conductivity, silica nanoparticles were coated on the CuNW surface to provide electrical insulation. As the polymer matrix, monodisperse PS particles prepared by emulsifier-free emulsion polymerization were used. The PS/silica-coated CuNW nanocomposites were fabricated using the latex blending technique. As the content of the silica-coated CuNW nanofiller increased, the nanocomposites showed no significant change in electrical conductivity while substantial increase in thermal conductivity.