Thermal conductivity of nanocarbon/polymer composites with high filler content fabricated using low-viscosity resin
발표자
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초록
내용
Due to the miniaturization of electronic devices, interest in lightweight materials exhibiting heat dissipation performance is increasing. It is known that the thermal conductivity of polymer composites containing nanocarbons, such as graphene (~3000 W/m·K) and carbon nanotubes (~3000 W/m·K), is limited by the interfacial thermal resistance and the contact thermal resistance. Recently, many studies have been reported on the thermal percolation of polymer composites due to the contact between fillers occurring above a certain content of graphene (＞ 15 vol%). In this study, polymer composites with high filler content were prepared using low melt viscosity resins to induce contact between the nanocarbons in the structure. In addition, the thermal conductivity of the fabricated composites was investigated experimentally and theoretically.