Studies on preparation and properties of polyimide-based epoxy adhesives
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초록
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Polyimide exhibits very high mechanical strength and toughness, as well as excellent heat and chemical resistance. In particular, in recent years, researches using polyimides as a binder for a positive/negative electrode active material have been conducted for the purpose of developing a lithium secondary battery that stably operates at high voltage and high temperature based on such mechanical, thermal and chemical stability. In this study, we intend to develop a new polyimide-based epoxy adhesive with improved adhesion. When preparing the polyimide, the amino group was left unreacted at the terminal, and then it was used as a curing agent and mixed with an epoxy compound. As a result, it was found that very strong adhesion to various surfaces was observed after curing. In the conference, we would like to describe how the curing rate changes with temperature and time, and how the thermal and mechanical adhesion properties change depending on the ratio of imide and epoxy.