Characterization of High Performance, High Heat Resistant Polyimides Containing Benzoxazole Monomer
발표자
()
초록
내용
Among polymers, Polyimide (PI) is widely used in electronic devices, semiconductor devices, and printed circuit board industries because of its excellent glass transition temperature, dimensional stability and heat resistance, dielectric properties, and metal adhesion. In general, Polybenzoxazole (PBO) has higher heat resistance than PI. In this study, a diamine monomer introduced as a Benzoxazole unit was synthesized to increase the heat resistance of PI. PI Film was produced by reacting the prepared benzoxazole diamine and 5 kinds of dianhydrides. It was confirmed that Diamine was synthesized through Fourier Transform Nuclear Magnetic Resonance (FT-NMR), and PI Film was analyzed through Fourier Transform Infrared Spectroscopy (FT-IR). The thermal properties of the film were analyzed through a thermal gravimetric analyzer (TGA), and the mechanical properties were analyzed through UTM.