The moisture barrier film using thermal epoxy resin and Atomic Layer Deposition
발표자
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초록
내용
The organic luminescent material easily loses its luminescence once it is exposed to moisture, and the highly reactive cathode with low work function will be easily corroded by moisture and oxygen. To solve this problem, We demonstrate flexible moisture barrier film encapsulation for organic electronics using low temperatures process method. To realize the flexible barrier, the best practice is to make the barrier as multilayer structure. Low temperatures process applied the atomic layer deposition(ALD) method and epoxy coating method to deposit barrier films. Organic-inorganic layers work as moisture barrier and very thin thickness provide the flexibility and planarization. The moisture permeation characteristics of the optimized Al2O3/ 4-component adhesive multilayer films were finally measured using Ca-test's WVTR measuring instrument and WVTR values lower than the detection limit of the measuring device were obtained.