Universal 3D-crosslinker for solution-processed electronics
발표자
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초록
내용
Solution-processed electronics demands multiple steps of patterning and stacking of diverse device components. Here, we show the fabrication of greatly combined arrays of electronic devise (organic transistors and logic gates) entirely through a series of solution processes. The fabrication is done using a tetrahedral geometry containing a perfluorophenyl azide moiety, referred to as 4Bx. 4Bx can be mixed with a variety of solution-processable electronic materials and generate cross-linked network under exposure to UV. Fully crosslinked network film can be formed at a tiny 4Bx amount, which enables preserving the inherent electrical and structural characteristics of host material. Because the cross-linked network layer is strongly resistant to chemical solvents, micropatterning the layers at high resolution as well as stacking the layers on top of each other by series of solution processing steps is possible.