MXene (Ti3AlC2) incorporated polyimide hybrid composite films
발표자
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초록
내용
In this work, we synthesized polyimide(PI)/MXene hybrid composite films via thermal imidization process using MXene(Ti3C2) as a filler. Polyimides(PIs) are well known for having excellent thermal stability, good chemical resistance and good flexibility. First, polyamic acid(PAA) was synthesized via solution polymerization in DMAc using ODA and PMDA as precursors. MXenes were prepared by etching the Al layers from Ti3AlC2 using HF aqueous solution or LiCl-HCl solution. PI/MXene hybrid composite films with different content (0.5wt%~10wt%) were prepared and characterized by Fourier transform infrared(FTIR) spectroscopy, X-ray diffractometer(XRD) and scanning electron microscopy(SEM), thermogravimetric analysis(TGA), differential scanning calorimetry(DSC), and inductance(L)-capacitance(C)-resistance(R)(LCR) meter. The PI/MXene hybrid composite films are expected to have a controlled dielectric constant, improved thermal stability and a low coefficient of thermal expansion (CTE).