A new droplet based stretchable substrate with high modulus resolution and stretchable stability via simultaneous curing
발표자
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초록
내용
Soft electronics is a promising field as a next-generation electronic device that can interact with humans. Therefore, efforts are being made to develop flexible electronic devices. Strain isolation is known as the most common strategy in that it maintains the performance of a inorganic based device and can easily control mechanical deformation. However, the method of controlling the stiffness of a single materialhas limitations in process complexity, stiffness control. Here, we improved the modulus control and resolution by using two pre-polymers. Furthermore, by using a simultaneous curing technique we can obtain a highly durable substrate that does not break even after repeated stretching of 75%. As a result, the potential of the technology has been demonstrated by applying it to the stretchable mircroheater system, which shows that it is a next-generation stretchable substrate manufacturing technology that can replace human-friendly devices.