Synthesis and preparation of low dielectric Polyimide having excellent adhesion property
발표자
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초록
내용
Due to the development of 5G communication, the amount of data transmission is needed and high frequency band is used. To reduce signal loss, Dielectric substrate should be required having low-dielectric and low-dielectric loss property. In this study, we designed new polyimide structure. The long aliphatic diamine was used to increase free volume, and cross-linking moiety was introduced to reduce the polarization. This leads to low dielectric and low dielectric loss. Polyimide as well as copper foil are used for 5G communication. The low-roughness copper foil used as a 5G communication has a problem of low adhesion to polyimide. Therefore, alkoxy silane compound was introduced to improve adhesion. We can obtained polyimide having a dielectric constant of 2.6 or less at 1 GHz and adhesive strength 1000gf/cm or more.