Thermal and mechanical properties of silica-filled epoxy molding compound for fan out wafer level packaging
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초록
내용
Looking into the inside of the package, different materials such as silicon chips, metal electrodes and epoxy resin are used. When it exposed to high temperatures, which can cause problems caused by CTE-mismatch between components. When the temperature changes rapidly, thermal stress occurs on the interface between the dissimilar materials, resulting in interfacial cracking or bending. Therefore, epoxy composite materials with low coefficient of thermal expansion are needed. By adding silicas of different size and content to the epoxy, the warpage can be improved by lowering the CTE. The properties of the mixture between the epoxy material and the filler are very important and are analyzed to construct the optimal mix composition. UTM, DMA, TMA and LFA were also measured to identify the thermal and mechanical properties of these epoxy composite materials. Based on this data, epoxy composites with low CTE and low modulus properties can be created.