Preparation of LaF<SUB>3</SUB>/Polyimide-Based PolyHIPEs Nanocomposite Foam with Low Dielectric Constant <EM>via</EM> Pickering High Internal Phase Emulsions
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초록
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Polyimides have been widely utilized as packaging material and dielectric layers for the electronic and micro electronic industry because of their outstanding characteristics such as low dielectric constant. In this study poly(amic acid) salt (PAAS) was synthesized using 4,4′-(Hexafluoroisopropylidene)-diphthalic anhydride and 3,3′-Dimethylbenzidine (m-toluidine). LaF3 nanoparticles with an average diameter of 20nm were added PAAS aqueous solution. HIPEs were prepared by adding cyclohexane as an internal phase in an aqueous dispersion and subsequent homogenization. LaF3/polyimide-based polyHIPEs nanocomposite foam was prepared through freeze-drying and subsequent thermal imidization of LaF3/PAAS-based HIPEs. The characteristics of the LaF3/polyimide-based polyHIPEs nanocomposite foam, including their morphology, thermal decomposition temperature, and dielectric constant were investigated.