POS7-0885
Vertically Aligned Boron Nitride/MgO Hybrid Filler Networks for Thermally Conductive Epoxy Composites
Topic
S7. Innovations in Polymeric Composites: From Design and Processing to Industrial Applications
When and Where
Oct 1, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Jinkee HONG
Ki Su KIM
Presenter(s)
NanHee Lee (School of Semiconductor Convergence Engineering, Kyungpook National University)
Co-Author(s)
Abstract
As electronic devices become increasingly compact and highly integrated, polymer-based packaging materials with improved heat dissipation capability are required for reliable device operation. In this study, we designed thermally conductive epoxy composites using hybrid ceramic filler networks composed of boron nitride (BN) and magnesium oxide (MgO). A vertically aligned BN framework was introduced to provide directional heat conduction pathways within the epoxy matrix, while MgO particles were incorporated to complement the BN network and improve the continuity of thermally conductive domains. This hybrid filler design was expected to reduce thermally insulating gaps between fillers and promote more efficient heat transfer through the composite. The morphology and distribution of the BN/MgO fillers were examined using scanning electron microscopy (SEM). The thermal stability and glass transition temperatures of the epoxy composites were analyzed by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC), respectively. The viscoelastic properties of the composites were evaluated using dynamic mechanical analysis (DMA). Infrared (IR) thermal imaging was also used to visualize the heat dissipation behavior of the composite materials. This study suggests that vertically aligned BN combined with MgO fillers can serve as a promising design strategy for epoxy-based thermal management materials in electronic packaging applications.
