POS7-1251
Multiscale MgO Filler Design for Thermally Conductive Epoxy Molding Composites
Topic
S7. Innovations in Polymeric Composites: From Design and Processing to Industrial Applications
When and Where
Sep 30, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Heesuk KIM
Jinhye BAE
Presenter(s)
Chaemin Yeo (Department of Semiconductor Convergence Engineering, Kyungpook National University)
Co-Author(s)
Abstract
Epoxy molding compounds (EMCs) are widely used as encapsulation materials in semiconductor packaging because of their mechanical stability, processability, and cost-effectiveness. However, the intrinsically low thermal conductivity of epoxy resin limits heat dissipation in highly integrated electronic devices. High filler loading can improve thermal conductivity, but it often causes a significant increase in viscosity and poor processability. In this study, we investigated multiscale magnesium oxide (MgO) filler systems to improve the thermal transport properties of epoxy-based composites while maintaining processability. MgO particles with different sizes were incorporated into the epoxy matrix to enhance filler packing and reduce void spaces between larger particles. The optimized particle size distribution was designed using the Dinger–Funk equation, and epoxy composites with different filler compositions were prepared for comparison. The morphology and dispersion state of the MgO fillers were examined by scanning electron microscopy (SEM). The thermal conductivity of the composites was evaluated as a function of filler content and filler composition. Dynamic mechanical analysis (DMA) was performed to investigate the storage modulus, damping factor, and glass transition temperature (Tg) of the composites. Rheological measurements were also conducted to assess the viscosity and processability of the composite formulations. This study suggests that multiscale MgO filler design can provide a practical strategy for developing thermally conductive epoxy molding composites by improving filler packing and balancing thermal conductivity with processability.
