POS7-0876
Thermally Conductive Epoxy Molding Compounds with BN/MgO Hybrid Fillers for Electronic Packaging
Topic
S7. Innovations in Polymeric Composites: From Design and Processing to Industrial Applications
When and Where
Oct 1, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Jinkee HONG
Ki Su KIM
Presenter(s)
Minbeom Sim (Kyungpook National University)
Co-Author(s)
Abstract
As electronic devices become increasingly miniaturized and highly integrated, efficient heat dissipation through packaging materials is essential for maintaining device reliability and lifetime. Epoxy molding compounds (EMCs) are widely used in electronic packaging, but their intrinsically low thermal conductivity limits their heat transfer performance. In this study, we investigated a hybrid filler strategy using magnesium oxide (MgO) and hexagonal boron nitride (h-BN) to enhance the thermal conductivity of epoxy-based composites while considering their processability. Spherical MgO particles and two-dimensional h-BN platelets were incorporated into an epoxy matrix to construct thermally conductive filler networks. The hybrid filler design was intended to combine the packing and viscosity-control advantages of MgO with the high thermal transport capability of h-BN. The morphology and dispersion state of the fillers in the epoxy matrix were examined using scanning electron microscopy (SEM). The thermal conductivity of the composites was evaluated as a function of filler loading and filler composition. In addition, the rheological behavior of the composite formulations was analyzed using a rheometer to assess the influence of filler geometry and hybrid filler ratio on processability. The BN/MgO hybrid filler system provided improved thermal conductivity compared with single-filler epoxy composites while allowing the viscosity increase to be moderated by controlling the filler composition. These results suggest that the combination of spherical MgO and plate-like h-BN can provide a practical approach for designing thermally conductive epoxy molding compounds for electronic packaging applications.
