POS4-0814
Self-Healing and Wringing Diacetylene-Functionalized Organogels for Smart Soft Materials
Topic
S4. Colloids, Interfaces, and Molecular Assemblies for Functional Soft Materials
When and Where
Sep 30, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Heesuk KIM
Jinhye BAE
Presenter(s)
Hyerim Lee (Jeonbuk National University)
Co-Author(s)
Abstract
To develop advanced soft materials, diacetylene (DA)-based dendrons are newly designed with either amide (DA-a) or ester (DA-e) linkages connecting the DA moiety to flexible dendrons, enabling control over supramolecular packing. DA-a forms a smectic C like nanostructure through intermolecular hydrogen bonding, providing a suitable molecular organization for topochemical polymerization. In contrast, DA-e forms an alternating smectic A like arrangement that inhibits polymerization. These structural differences are further supported by UV-vis and FT IR analysis. Upon UV irradiation, DA-a undergoes polydiacetylene formation which leads to increased absorbance at 600 nm, a pinkish white to purple color transition, and suppression of the 2354 cm-1 alkyne band due to ene-yne formation. However, DA-e shows no such changes because topochemical polymerization does not occur. Based on these structural characteristics, DA-a based organogels are fabricated in both polar and nonpolar solvents and their 3D networks are stabilized by photopolymerization. The organogel formed in a nonpolar solvent shows fast self-healing which is attributed to rapid gel-sol transitions. In polar solvent, the organogel exhibits solvent wringing upon heating. These results demonstrate that DA-based organogels are promising candidates for smart soft materials applicable to soft robotics and biomedical devices. This work was supported by the Bilateral Exchange Program (RS-2026-25442827) and BK 21 FOUR Program.
