POS4-0812
Correlation between the Photodimer Content within Stimuli-Responsive Molecular Layers at Adhesion Interfaces and Peel Behavior
Topic
S4. Colloids, Interfaces, and Molecular Assemblies for Functional Soft Materials
When and Where
Sep 29, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Hae Jung SON
Boseok KANG
Presenter(s)
Kento Higa (Laboratory for Chemistry and Life Science, Institute of Integrated Research, Institute of Science Tokyo)
Co-Author(s)
Abstract
Switchable adhesives for applications in fields such as biomedicine, robotics and recycling have attracted significant attention. They reduce adhesive strength in response to external stimuli such as heat, light, magnetic fields, and chemical treatment, but require a lot of stimuli-responsive molecules, making it difficult to balance cohesive strength and dismantlability. Recently, we proposed a novel dismantlable adhesion system based on chemical bonds at the adhesion interface. We have fabricated a stimuli-responsive molecular layer composed of anthracene,1) which exhibits reversible chemical bond formation and cleavage upon photoirradiation and heating.2,3) By introducing it at an adhesion interface as a dismantlable primer, we achieved switchable adhesion and dismantling from the interface. While it has been demonstrated that the chemical bonds formed at the adhesion interface by anthracene photodimers contribute to adhesive strength, the specific extent to which these bonds influence adhesion behavior remains to be investigated. In this study, we report the influence of anthracene photodimer content within the molecular layer on peel behavior. The photodimer content was estimated from absorbance and adhesion behavior evaluated by 90° peel tests. We made substrates modified with molecular layers containing anthracene photodimers by photodimerization reaction. At this point, the amount of anthracene dimers present in the layer was varied by adjusting conditions such as exposure intensity and exposure time. Peel strength increased with anthracene photodimer content, indicating that photodimerization reaction enhances adhesion. Furthermore, the failure mode shifted from interfacial failure to cohesive failure.
References
1) M. Aizawa, H. Akiyama, Y. Matsuzawa, Colloids Surf. A 2021, 616, 126301.
2) M. Aizawa, H. Akiyama, Y. Matsuzawa, Adv. Eng. Mater. 2022, 24, 2100823.
3) M. Aizawa, H. Akiyama, Y. Matsuzawa, A. Shishido, Polym. J. 2024, 56, 401.
References
1) M. Aizawa, H. Akiyama, Y. Matsuzawa, Colloids Surf. A 2021, 616, 126301.
2) M. Aizawa, H. Akiyama, Y. Matsuzawa, Adv. Eng. Mater. 2022, 24, 2100823.
3) M. Aizawa, H. Akiyama, Y. Matsuzawa, A. Shishido, Polym. J. 2024, 56, 401.
