POS7-0011
Novel PLA/wood flour WPC composite with biomimetic compounds for laser assisted electroless metallization
Topic
S7. Innovations in Polymeric Composites: From Design and Processing to Industrial Applications
When and Where
Oct 1, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Jinkee HONG
Ki Su KIM
Presenter(s)
Krzysztof Moraczewski (Kazimierz Wielki University)
Co-Author(s)
Abstract
Wood–plastic composites (WPCs) are a class of materials obtained by combining thermoplastic polymers with lignocellulose. The use of natural raw materials as fillers enables partial substitution of the polymer matrix, which results in reduced production costs, decreased product weight, and improved environmental sustainability. WPC composites are widely applied in construction, the automotive industry, furniture manufacturing, and packaging, providing an alternative to conventional synthetic and wooden materials. An important aspect of research on WPCs is the extension of their potential applications into new industrial fields. For this purpose, investigations were undertaken on a novel WPC designed for electroless metallization assisted by laser irradiation. The newly developed PLA-based WPCs incorporate specially modified wood flour. The modification of the wood flour was carried out using two biomimetic compounds (tannic acid and dopamine). The biomimetic coating modification enabled the deposition of silver (Ag) atoms on the surface of the flour particles. These Ag atoms act as catalyst in the subsequent electroless metallization. The Ag modified wood flour was subsequently incorporated into the polymer matrix at concentrations of 10 or 30wt%. The resulting composite was selectively irradiated with an Nd:YAG laser with a power of up to 20W, using different frequencies and scanning speeds. In the case of dopamine-modified wood flour, it was possible to obtain a high-quality copper conductive tracks. Copper deposition occurred exclusively in the regions subjected to laser modification. The structure of the deposited copper layer was homogeneous and compact, which resulted in good electrical conductivity of the obtained paths. Additionally, the obtained WPCs exhibits favourable processing, mechanical, and thermal properties, which enable its potential application in electronics, for example in the production of MID green-based housings for electronic devices.
