POS9-0765
Adaptive Soft Electronics Platform Based on Reprocessable Dynamic Polymer Frameworks
Topic
S9. Polymer Technology for Sustainability
When and Where
Sep 30, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Heesuk KIM
Jinhye BAE
Presenter(s)
Jihun Noh (Sungkyunkwan University)
Co-Author(s)
Abstract
Flexible electronics require polymer substrates that not only withstand mechanical, thermal, and chemical stress, but also integrate planar thin-film processability, post-fabrication shape fixation, and circular material use within single platform. In this presentation, we report a bisphenol-A-diglycidyl-ether-based epoxy covalent adaptable network (CAN) substrate that combines bond-exchange-enabled reprocessing, shape memory, and chemically recyclable depolymerization while remaining compatible with standard thin-film manufacturing. The optimized CAN substrate exhibits robust thermomechanical properties and serves as a recyclable backplane platform for thin-film transistors. Integrated Se–Te/TeOx p-type and In2O3 n-type TFTs, together with NAND/NOR logic gates and 6T-SRAM array demonstrations, validate its potential for complementary thin-film circuit integration on shape-morphable substrates. Closed-loop recycling through mechanical reprocessing and depolymerization followed by repolymerization reincorporates recovered substrate materials into regenerated CANs while preserving thermomechanical and shape-programming functionality. This platform combines shape reconfigurability, device-level performance, circuit compatibility, and substrate recyclability, offering a sustainable alternative to conventional nonrecyclable plastics for next-generation field-deployable electronics.
