POS4-0745
Phase-Separation-Engineered Conductive Photoresist for Ultra-High-Resolution Micro-LED Transfer
Topic
S4. Colloids, Interfaces, and Molecular Assemblies for Functional Soft Materials
When and Where
Sep 29, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Hae Jung SON
Boseok KANG
Presenter(s)
Sehoon Jung (Pusan National University)
Co-Author(s)
Abstract
Micro-LED displays have attracted significant attention as next-generation display technologies because of their high brightness, long operational lifetime, and potential for ultra-high-resolution integration. However, the transfer process, which requires the precise alignment and electrical interconnection of millions of micro-LED chips on a receiving substrate, remains a critical technical challenge. In this study, we propose a conductive photoresist (PR) structure designed to provide vertical electrical conduction while retaining the intrinsic photopatternability of the PR. A phase-separated morphology was induced within the PR layer by introducing a nonpolar nonsolvent into the PR solution. Metal was subsequently deposited along the phase-separated regions to form conductive pathways within the PR matrix. Unlike conventional conductive PR systems that rely on the incorporation of conductive fillers, the proposed approach utilizes nonsolvent-induced phase separation to define the conductive pathways. This strategy provides a new material-design concept for conductive interconnection layers applicable to ultra-high-resolution micro-LED transfer processes.
