POS7-0719
Materials Design of Thermally Conductive Adhesives for Interfacial Thermal Transport in Electronics
Topic
S7. Innovations in Polymeric Composites: From Design and Processing to Industrial Applications
When and Where
Sep 30, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Heesuk KIM
Jinhye BAE
Presenter(s)
Jinsoo Na (Department of Materials Science and Engineering, Seoul National University)
Co-Author(s)
Abstract
Thermally conductive adhesive materials for advanced electronics are increasingly required to manage higher heat fluxes while maintaining conformal contact with rough, warped, and pressure-limited interfaces. A major challenge in highly filled adhesive systems is that the ceramic fillers needed for heat conduction typically increase stiffness and deteriorate processability, leading to poor interfacial wetting, bonding defects, and limited cross-interface heat transfer. To address this trade-off, we developed a thermally conductive adhesive system that improves interfacial thermal transport without sacrificing adhesion or bonding durability. The formulation relies on an integrated materials-design strategy aimed at balancing heat conduction, interfacial contact, and mechanical compliance. As a result, the adhesive exhibits a favorable combination of thermal conductivity, adhesion strength, and electrical insulation. These results demonstrate a practical and scalable materials strategy for high-performance thermal interfaces in next-generation electronic devices.
