ORGS5-0630
Off-Stoichiometric Design of Disulfide-Linked Epoxy-Based CAN Structural Adhesives with Reusability for Elevated-Temperature Applications
Topic
GS5. Graduate Student Oral Session V: Sustainable Polymers and Circular Materials
When and Where
Sep 28, 2026
14:24 - 14:36
Room 105
Session Chairs
Taehoo CHANG
Taejun EOM
Chae Bin KIM
Presenter(s)
Jae Hong Park (Pusan national university)
Co-Author(s)
Abstract
Structural adhesives are widely used in automotive, aerospace, electronics, and construction industries because they provide durable bonding between dissimilar materials while offering lightweight design and thermal stability. However, most epoxy structural adhesives are thermosets that form permanently crosslinked networks after curing, making repair, reprocessing, and reuse difficult once failure.
To address these limitations, this study investigates disulfide-linked epoxy covalent adaptable network (CAN) structural adhesives for elevated-temperature applications. The CAN network was prepared by curing diglycidyl ether of bisphenol A (DGEBA) with a disulfide-containing diamine crosslinker. Dynamic disulfide bonds enable thermally activated bond exchange, allowing network rearrangement and stress relaxation while maintaining the structural integrity required for load-bearing adhesive applications.
The epoxy-to-amine ratio was systematically varied to generate off-stoichiometric networks with different concentrations of permanent and dynamic covalent linkages. Because epoxy–amine curing often deviates from ideal stoichiometry owing to differences in amine reactivity, diffusion limitations, and side reactions, the epoxy/amine ratio serves as an important parameter governing network architecture and adhesive performance.
The influence of composition on network formation, wettability, thermomechanical properties, stress-relaxation behavior, adhesion strength, and re-adhesion efficiency was systematically investigated. The results reveal how off-stoichiometric network design controls the balance between structural stability and dynamic adaptability. This study provides insight into the relationship between network architecture, initial adhesion performance, and CAN-assisted reusability, offering molecular design guidelines for high-temperature structural adhesives that combine strong bonding with repair and reuse enabled by dynamic covalent network rearrangement.
To address these limitations, this study investigates disulfide-linked epoxy covalent adaptable network (CAN) structural adhesives for elevated-temperature applications. The CAN network was prepared by curing diglycidyl ether of bisphenol A (DGEBA) with a disulfide-containing diamine crosslinker. Dynamic disulfide bonds enable thermally activated bond exchange, allowing network rearrangement and stress relaxation while maintaining the structural integrity required for load-bearing adhesive applications.
The epoxy-to-amine ratio was systematically varied to generate off-stoichiometric networks with different concentrations of permanent and dynamic covalent linkages. Because epoxy–amine curing often deviates from ideal stoichiometry owing to differences in amine reactivity, diffusion limitations, and side reactions, the epoxy/amine ratio serves as an important parameter governing network architecture and adhesive performance.
The influence of composition on network formation, wettability, thermomechanical properties, stress-relaxation behavior, adhesion strength, and re-adhesion efficiency was systematically investigated. The results reveal how off-stoichiometric network design controls the balance between structural stability and dynamic adaptability. This study provides insight into the relationship between network architecture, initial adhesion performance, and CAN-assisted reusability, offering molecular design guidelines for high-temperature structural adhesives that combine strong bonding with repair and reuse enabled by dynamic covalent network rearrangement.
