POS7-0599
Hierarchical Free-Volume Engineering of UV-Curable Cycloaliphatic Epoxy Composites for Low-Dielectric Insulating Applications
Topic
S7. Innovations in Polymeric Composites: From Design and Processing to Industrial Applications
When and Where
Sep 30, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Heesuk KIM
Jinhye BAE
Presenter(s)
Min-Young Hwang (Department of Applied Organic Materials Engineering, Chungnam National University)
Co-Author(s)
Abstract
Low-dielectric materials for organic interposers and redistribution layers require low dielectric loss, high thermomechanical stability, and compatibility with rapid, low-temperature processing. In this study, a UV-curable cycloaliphatic epoxy composite platform was designed using a chemically unified cationic curing system and a hierarchical free-volume engineering strategy. A low-polarizability cycloaliphatic epoxy was employed as the matrix, while epoxycyclohexyl-functionalized polyhedral oligomeric silsesquioxane (POSS) was incorporated to generate nanoscale free volume and improve thermal stability. Hollow glass microspheres (HGMs) surface-modified with β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane were further introduced as microscale low-dielectric fillers. The epoxycyclohexyl-functionalized surface was designed to enhance compatibility and interfacial coupling with the epoxy matrix, thereby suppressing dielectric loss associated with interfacial polarization. By combining molecular-level low-polarity epoxy chemistry with nanoscale POSS-derived free volume and microscale HGM cavities, the proposed composite system provides an effective approach for achieving low dielectric properties, rapid UV curability, dimensional stability, and high-Tg thermomechanical performance for next-generation organic interposer applications.
