POS7-0587
Hybrid Reinforcement of Polyimide Nanocomposites Using Aramid Nanofibers and POSS for Flexible Circuit Board Applications
Topic
S7. Innovations in Polymeric Composites: From Design and Processing to Industrial Applications
When and Where
Oct 1, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Jinkee HONG
Ki Su KIM
Presenter(s)
Seung-Hun Chae (Department of Applied Organic Materials Engineering, Chungnam National University)
Co-Author(s)
Abstract
Reducing the dielectric constant of polymeric insulating materials often leads to deterioration of mechanical properties due to increased free volume. In this study, polyimide (PI) nanocomposite films containing aramid nanofibers (ANFs) and aminopropylisobutyl-polyhedral oligomeric silsesquioxane (POSS) were fabricated to achieve both low dielectric properties and mechanical reinforcement. ANFs were introduced to form a reinforcing nanofibrous network, while POSS was incorporated as a low-dielectric nanofiller owing to its porous cage structure and free-volume-generating characteristics. The morphology, interfacial interactions, thermal behavior, mechanical properties, and dielectric characteristics of the nanocomposite films were systematically investigated. The incorporation of ANFs improved stress transfer efficiency and mechanical robustness, whereas POSS contributed to dielectric constant reduction by increasing free volume and suppressing dielectric polarization. Furthermore, favorable interfacial interactions among ANFs, POSS, and the PI matrix promoted uniform filler dispersion and enhanced overall composite performance. These results demonstrate that the synergistic combination of ANFs and POSS is an effective strategy for developing mechanically robust, low-dielectric PI films for advanced flexible printed circuit board applications.
Keywords: Polyimide nanocomposites, Aramid nanofibers, Polyhedral oligomeric silsesquioxane, Low dielectric materials, Flexible printed circuit boards
Keywords: Polyimide nanocomposites, Aramid nanofibers, Polyhedral oligomeric silsesquioxane, Low dielectric materials, Flexible printed circuit boards
