POS7-0537
Effects of BNNS Surface Chemistry on the Thermal, Dielectric, and Mechanical Properties of Epoxy Composites
Topic
S7. Innovations in Polymeric Composites: From Design and Processing to Industrial Applications
When and Where
Oct 1, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Jinkee HONG
Ki Su KIM
Presenter(s)
Yujin Noh (Department of Applied Organic Materials Engineering, Chungnam National University)
Co-Author(s)
Abstract
Hexagonal boron nitride nanosheets (BNNSs) are attractive fillers for epoxy-based semiconductor packaging materials owing to their high thermal conductivity and electrical insulation. In this study, BNNSs were surface-functionalized with amine or epoxy groups to investigate the effects of interfacial chemistry on the multifunctional properties of epoxy composites. The successful functionalization of BNNSs was confirmed by structural and surface analyses. Amine-functionalized BNNSs (A-BNNSs) and epoxy-functionalized BNNSs (E-BNNSs) were incorporated into epoxy matrices, and their influences on thermal, dielectric, thermomechanical, and mechanical properties were systematically evaluated. Surface functionalization enhanced interfacial interactions between BNNSs and the epoxy matrix, leading to differences in filler dispersion, heat transfer, dielectric response, and stress transfer behavior. Consequently, A-BNNS/epoxy and E-BNNS/epoxy composites exhibited distinct thermal conductivity, dielectric properties, storage modulus, impact strength, and flexural strength. Fracture surface analysis further revealed the critical role of interfacial structure in determining composite performance. These results demonstrate that BNNS surface chemistry is an effective tool for tailoring the thermal, dielectric, and mechanical properties of epoxy composites for advanced electronic packaging applications.
Keywords: Boron Nitride Nanosheets, Surface Functionalization, Epoxy Composites, Dielectric Properties, Interfacial Engineering
Keywords: Boron Nitride Nanosheets, Surface Functionalization, Epoxy Composites, Dielectric Properties, Interfacial Engineering
