POS7-0522
Low-Dielectric Polyimide Films Prepared via Physical Entanglement and Thermal Decomposition of Poly(2-hydroxyethyl methacrylate)
Topic
S7. Innovations in Polymeric Composites: From Design and Processing to Industrial Applications
When and Where
Oct 1, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Jinkee HONG
Ki Su KIM
Presenter(s)
Geun Seong Lee (Department of Organic Materials Engineering, Chungnam National University)
Co-Author(s)
Abstract
Polyimide (PI) films with low dielectric constants are highly desirable for advanced electronic and flexible insulating applications. In this study, porous PI films were fabricated by physically blending high-molecular-weight poly(2-hydroxyethyl methacrylate) (pHEMA) with a poly(amic acid) (PAA) precursor, followed by thermal decomposition of the sacrificial pHEMA phase during thermal imidization. Owing to strong physical entanglement between the high-molecular-weight pHEMA chains and the PAA matrix, macroscopic phase separation during solvent evaporation was effectively suppressed, resulting in a uniformly distributed porous structure after pHEMA decomposition. The pore morphology and chemical structure were characterized by SEM and FT-IR, while thermal stability, mechanical properties, and dielectric behavior were evaluated using TGA, tensile testing, and LCR measurements, respectively. The porous PI films exhibited a significantly reduced dielectric constant while maintaining low dielectric loss and satisfactory mechanical integrity. The uniformly distributed pores effectively increased the air volume fraction without generating severe structural defects, thereby improving dielectric performance. This physical entanglement-assisted sacrificial templating strategy provides a simple and scalable approach for fabricating low-dielectric porous PI films for next-generation flexible electronic insulation applications.
Keywords : Porous polyimide, Sacrificial template, Dielectric properties, physical entanglement
Keywords : Porous polyimide, Sacrificial template, Dielectric properties, physical entanglement
