POS7-0505
Flexible Low-Dielectric Thermotropic Liquid Crystalline Polymer Films Reinforced with Low-Loading Aramid Nanofibers for High-Frequency Substrate Applications
Topic
S7. Innovations in Polymeric Composites: From Design and Processing to Industrial Applications
When and Where
Sep 30, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Heesuk KIM
Jinhye BAE
Presenter(s)
Kim Min-cheol (Department of Applied Organic Materials Engineering, Chungnam National University)
Co-Author(s)
Abstract
Flexible low-dielectric polymer substrates with high mechanical durability are essential for next-generation high-frequency communication devices subjected to repeated bending and folding. In this study, thermotropic liquid crystalline polymer (TLCP) composite films reinforced with low-loadings of aramid nanofibers (ANFs) were prepared via melt blending followed by hot pressing. The incorporated ANFs were expected to regulate TLCP chain packing through non-covalent interactions while enhancing stress transfer and resistance to crack propagation. The morphology, thermal stability, rheological behavior, dynamic mechanical properties, and dielectric characteristics of the films were investigated using SEM, TGA, DSC, rheometry, DMA, and dielectric measurements. The ANF/TLCP composite films exhibited improved foldability and mechanical durability while maintaining the intrinsically low dielectric properties of the TLCP matrix. These findings suggest that low-loading ANFs are effective reinforcements for developing flexible low-dielectric substrates suitable for high-frequency communication applications.
Keywords : Thermotropic Liquid Crystalline Polymer, Aramid Nanofibers, Low Dielectric Materials, Flexible Substrates
Keywords : Thermotropic Liquid Crystalline Polymer, Aramid Nanofibers, Low Dielectric Materials, Flexible Substrates
