POS4-0332
Sequential Interfacial Transfer Printing of Three-Dimensional Quantum Dot Structures
Topic
S4. Colloids, Interfaces, and Molecular Assemblies for Functional Soft Materials
When and Where
Sep 29, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Hae Jung SON
Boseok KANG
Presenter(s)
JeongHun Shin (Pusan National University)
Co-Author(s)
Abstract
The ability to organize Colloidal quantum dots (QDs) into vertically stacked architectures offers opportunities for constructing three-dimensional nanostructures that enable enhanced light–matter interactions and new optical functionalities. However, despite these advantages, achieving controllable multilayer stacking of patterned QD layers while preserving structural integrity remains challenging. Here, we present a strategy for constructing multilayer QD architectures based on a via Sequential Interfacial Transfer Printing approach. This method enables the sequential stacking of patterned QD layers and allows the formation of three-dimensional structures while maintaining the structural fidelity of the nanoparticle patterns. After multilayer assembly, an immersion-assisted release step enables the stacked structures to be separated from the template without damaging the patterned layers. This strategy provides a versatile platform for assembling multilayer QD nanostructures and enables the construction of three-dimensional QD architectures through solution-compatible processes. The proposed approach may open new opportunities for advanced photonic and optoelectronic applications based on multilayer quantum dot structures.
