ORGS3-0312
Reconfigurable Anisotropic Thermal Composites Enabled by Borosiloxane Covalent Adaptable Networks
Topic
GS3. Graduate Student Oral Session III: Polymer Synthesis, Structure, Properties, and Processing
When and Where
Sep 28, 2026
14:00 - 14:12
Room 103
Session Chairs
Jiwon KIM
Junmin LEE
Youngwoon KO
Presenter(s)
Seungjae Shin (Pusan National University)
Co-Author(s)
Abstract
As electronic devices become increasingly complex and miniaturized, rapid and efficient heat dissipation is essential to prevent thermal degradation and performance loss. Thermal interface materials (TIMs) commonly incorporate thermally conductive ceramic or metallic fillers into polymer matrices, while maintaining sufficient flowability to fill interfacial gaps and minimize thermal contact resistance.
Here, we report a reprocessable anisotropic thermal composite consisting of aligned hexagonal boron nitride (hBN) fillers embedded in a dynamically crosslinked poly(dimethylsiloxane) network. A simple pressing process induces highly oriented hBN pathways, resulting in exceptionally high anisotropic thermal conductivity along the desired heat-transfer direction. The borosiloxane covalent adaptable network (CAN) provides self-healing capability, enabling damaged thermal pathways to reconnect after mechanical failure. In addition, the CAN imparts flowability and shape reconfigurability, allowing the composite to conform to interfacial gaps and be reshaped into curved or complex geometries while maintaining continuous hBN networks for directed heat transport.
Furthermore, the hydrolyzable borosiloxane network enables chemical disassembly of the composite, allowing high-yield recovery of polymeric components and hBN fillers. The recovered materials can be reused to reconstruct the composite, demonstrating closed-loop recyclability. This work presents a strategy for reconfigurable, repairable, and recyclable anisotropic thermal circuits, providing a versatile platform for advanced thermal management, thermal sensing, and heat-dissipation applications in next-generation soft electronics.
Here, we report a reprocessable anisotropic thermal composite consisting of aligned hexagonal boron nitride (hBN) fillers embedded in a dynamically crosslinked poly(dimethylsiloxane) network. A simple pressing process induces highly oriented hBN pathways, resulting in exceptionally high anisotropic thermal conductivity along the desired heat-transfer direction. The borosiloxane covalent adaptable network (CAN) provides self-healing capability, enabling damaged thermal pathways to reconnect after mechanical failure. In addition, the CAN imparts flowability and shape reconfigurability, allowing the composite to conform to interfacial gaps and be reshaped into curved or complex geometries while maintaining continuous hBN networks for directed heat transport.
Furthermore, the hydrolyzable borosiloxane network enables chemical disassembly of the composite, allowing high-yield recovery of polymeric components and hBN fillers. The recovered materials can be reused to reconstruct the composite, demonstrating closed-loop recyclability. This work presents a strategy for reconfigurable, repairable, and recyclable anisotropic thermal circuits, providing a versatile platform for advanced thermal management, thermal sensing, and heat-dissipation applications in next-generation soft electronics.
