POS4-0167
Electrospun Adsorptive Membranes for Efficient CMP Wastewater Treatment
Topic
S4. Colloids, Interfaces, and Molecular Assemblies for Functional Soft Materials
When and Where
Sep 30, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Heesuk KIM
Jinhye BAE
Presenter(s)
Jaewook Lee (POSTECH)
Co-Author(s)
Abstract
CMP wastewater accounts for approximately 40% of total semiconductor wastewater generated during the manufacturing process. Conventional treatments such as coagulation and flocculation generate excessive sludge, while pressure-driven membrane processes such as ultrafiltration and reverse osmosis often suffer from severe fouling. In this work, we propose an electrospun adsorptive membrane for CMP wastewater treatment, designed to selectively capture inorganic abrasive nanoparticles and metal ions through surface-mediated adsorption. The electrospun nanofibrous structure provides a high specific surface area and interconnected porous pathways, enabling both high water permeability and efficient contaminant adsorption. Polyacrylonitrile (PAN) was used as the supporting membrane due to its mechanical strength, chemical stability and ease of modification. Polyethyleneimine (PEI) and polyacrylic acid (PAA), which contain abundant amine and carboxyl groups capable of coordinating with metal ions, were sequentially assembled onto the PAN membrane through a Layer-by-Layer (LbL) process. The multilayer coating was optimized to balance water flux, adsorption capacity, and structural stability. In addition, crosslinking of PEI and PAA improved the stability of the coating, allowing repeated adsorption–desorption cycles even under extreme pH conditions. The prepared membrane may further regulate contaminant capture and release through pH-dependent changes in surface charge, enabling selective separation and potential recovery of valuable nanoparticles and metal ions from CMP wastewater.
