POS1-1575
Thermally Conductive Acrylic Thermosets Based on a Star-Shaped Aromatic Curing Agent
Topic
S1. Polymer Synthesis
When and Where
Sep 30, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Heesuk KIM
Jinhye BAE
Presenter(s)
Soo Jeong Jeong (Sookmyung Women's University)
Co-Author(s)
Abstract
The increasing integration density of advanced semiconductor devices has intensified heat generation and accumulation within packages. This challenge is particularly severe in vertically stacked High Bandwidth Memory, where restricted heat-dissipation pathways can reduce device performance, reliability, and lifespan. Therefore, thermally conductive polymer materials are required to minimize package thermal resistance and facilitate efficient heat transfer.
Conventional polymers exhibit low thermal conductivity (~0.2 W/mK) due to their disordered molecular structures. Enhancing the intrinsic thermal conductivity of the polymer matrix can achieve high thermal performance with low filler content. In this work, we developed an acrylic thermoset incorporating a star-shaped crystalline curing agent based on triyl tribenzoate. The curing agent’s rigid molecular structure, composed of four interconnected aromatic rings, promotes ordered packing and facilitates efficient phonon transport. In addition, its ester and amide groups enhance intermolecular hydrogen bonding within the polymer matrix, further improving heat transfer. Consequently, the resulting thermoset exhibits higher thermal conductivity than conventional thermoset systems. This thermoset system is therefore a promising candidate for thermal management applications, including semiconductor underfills and encapsulants.
Conventional polymers exhibit low thermal conductivity (~0.2 W/mK) due to their disordered molecular structures. Enhancing the intrinsic thermal conductivity of the polymer matrix can achieve high thermal performance with low filler content. In this work, we developed an acrylic thermoset incorporating a star-shaped crystalline curing agent based on triyl tribenzoate. The curing agent’s rigid molecular structure, composed of four interconnected aromatic rings, promotes ordered packing and facilitates efficient phonon transport. In addition, its ester and amide groups enhance intermolecular hydrogen bonding within the polymer matrix, further improving heat transfer. Consequently, the resulting thermoset exhibits higher thermal conductivity than conventional thermoset systems. This thermoset system is therefore a promising candidate for thermal management applications, including semiconductor underfills and encapsulants.
