Soft Electronic Packaging

Soft electronics have demonstrated great potential in cutting-edge fields such as human-machine interaction, health monitoring, and implantable medical devices, and are poised to shape future human lifestyles profoundly. For soft electronics to be practically applicable, they must operate with the same stability and reliability as conventional electronic devices. Achieving this goal critically depends on developing packaging materials and systems capable of accommodating large deformations. This talk will discuss several of our recent explorations in materials and processes for soft electronic packaging, including: elastomeric seals with viscoplastic surfaces for ultra-barrier performance under large deformation; high-density integration methods for incorporating inorganic functional components into highly deformable packaging substrates; organic fusion techniques for sealessly combining packaging substrates with device modules and animal tissues; and packging demonstrationgs across a variety of devices.