POS6-1456
Magnetic Self-Assembly of 3D Micro Pillar Electrodes for Highly Effective Supercapacitors
When and Where
Nov 30, -0001
00:00 - 00:00
Room 301 (Grand Ballroom)
Presenter(s)
Jeong HaeBin (Chung-Ang University)
Co-Author(s)
Abstract
With the increasing demand for scalable and efficient energy storage systems in emerging electronics, three-dimensional (3D) electrode structures have attracted much attention due to their ability to increase the surface area and enhance the electrochemical performance. However, conventional 3D fabrication methods require complex multi-step processes and specialized equipment, which are expensive and not suitable for large-scale production. In this study, we present a bottom-up, lithography-free strategy to fabricate high-surface-area electrodes using magnetic-field driven self-assembly of micro pillar structures. A dispersion consisting of poly(styrene-block-isoprene-block-styrene) elastomer in toluene and iron oxide nanoparticles is ultrasonicated and cast onto glass substrates placed over a magnetic field, inducing vertical alignment and pillar formation during solvent evaporation. The solvent evaporation process induced vertical alignment and pillar formation. The resulting 3D pillars are treated with oxygen plasma to modify the surface chemistry, promoting increased hydrophobicity, and are subsequently coated with a conductive gold layer via electroless deposition. The height of the self-assembled pillars is controlled by adjusting the concentration of iron oxide nanoparticles, producing structures with height ranging from 500 to 1200 μm. This bottom-up and scalable fabrication strategy offers precise control over high-aspect-ratio architectures, with potential applications in energy storage systems. The electrodes exhibit excellent electrochemical charge storage capacity and maintain mechanical stability. Our approach provides a versatile platform for the development of next-generation energy storage devices by combining structural tunability, material compatibility, and process scalability without complex patterning techniques.
