Molecular Design of Humidity-Robust Polymer Dielectrics for Ultra-Low-Loss High-Frequency Electronics

The rapid expansion of artificial intelligence (AI), high-performance computing, and Beyond 5G/6G communication technologies is driving the demand for advanced polymer dielectrics capable of supporting high-frequency signal transmission. As operating frequencies continue to increase, dielectric loss and moisture-induced degradation have become critical challenges for polymer insulating materials.
This presentation highlights recent advances in the molecular design of humidity-robust polymer dielectrics for high-frequency electronics. Particular attention will be given to structure–property relationships among polymer architecture, polarization behavior, moisture uptake, and dielectric performance. Molecular design strategies based on controlling molecular polarizability, free volume, and hydrophobicity will be discussed.
As a representative example, semi-aromatic polyimides containing cyclohexyl-substituted double-decker-shaped silsesquioxane (C-DDSQ) will be presented. The incorporation of DDSQ as a functional building block enables the simultaneous achievement of low dielectric loss, high thermal stability, and improved humidity resistance, demonstrating how precise molecular design can tailor dielectric performance through polymer structure. This talk will also discuss emerging concepts for next-generation dielectric materials, including the control of molecular fluctuations and water-related dielectric relaxation through polymer architecture engineering.
This presentation provides an overview of molecular design principles for humidity-robust polymer dielectrics and discusses future perspectives for polymer insulating materials that will underpin next-generation high-frequency electronics.