POS2-1451
Development of a Smart Bilayer Polymer Film with Reversible Pore Modulation for Thermal Management
Topic
S2. High-End Characterization/Polymer Physics/Properties
When and Where
Sep 29, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Hae Jung SON
Boseok KANG
Presenter(s)
YIKYUNG SHIM (Dankook University)
Co-Author(s)
Abstract
As the integration density of semiconductor devices and high-power electronic systems continues to increase, the demand for efficient thermal management technologies has become increasingly important. With their high specific surface area and outstanding heat dissipation capabilities, porous polymer-based thermal management materials have emerged as highly promising candidates, drawing considerable attention. The pore shapes of typical porous structures are usually set during production, making it difficult for them to adapt to different temperatures. We developed a bilayer polymer film in this study, featuring a porous polymer layer made with PEO aqueous solution-assisted pore formation and a thermoresponsive actuator layer beneath it. The reversible expansion and contraction of the actuator are designed to induce periodic tensile and compressive deformation in the porous layer, thereby enabling reversible pore opening and closing. This dynamic pore modulation is expected to actively regulate the porosity and microstructure of the film. Furthermore, the effects of pore-induced porosity changes on heat transfer and infrared radiative properties will be systematically investigated to establish a smart thermal management system capable of adaptively controlling heat dissipation under varying thermal conditions. The proposed bilayer polymer film with switchable pore structures is expected to provide a new platform for actively regulating structural and thermal management characteristics in response to temperature changes, overcoming the limitations of conventional static porous thermal management materials. Furthermore, this approach is anticipated to offer significant potential for next-generation functional thermal management materials for semiconductor packaging and high-power electronic devices.
